Air Conditioner Eliminator System and Method for Computer and Electronic Systems

ABSTRACT

A computer and electronic systems air conditioner eliminator heat exchange system and method for efficiently removing thermal energy or heat from heat-generating, thermally-sensitive equipment such as computer systems, electronic devices and other electronic equipment. The system in at least one embodiment includes one or more cooling caps ( 114, 214 ), one or more heat exchangers ( 112, 154, 212, 254, 412 ) and one or more pumps ( 118, 158, 218, 258, 418 ) to remove heat from the heat-generating equipment ( 190 ) and transfer that heat to a remote location from where the heat-generating equipment is located. The system and method in at least one embodiment perform this heat-exchange process without significantly losing any thermal energy to the atmosphere of the structure or room housing the heat-generating equipment.

I. FIELD OF THE INVENTION

This invention relates to a system and method for efficiently removing thermal energy or heat from structures that house computer systems, electronic devices and other heat-generating equipment.

II. BACKGROUND OF THE INVENTION

Current methods for heat removal from computer systems, electronic devices and other heat-generating equipment require at least two distinct stages. Stage 1 removes the heat directly from the heat generating components either by using forced air fans, heat sinks with fans, liquid cooling caps or other techniques. The heat exchange (heat rejection) takes place to the air in the room where the equipment resides. Stage 2 typically uses an air conditioning unit that then removes the heat from the air in the equipment room and exchanges the heat to the air outside of the building.

The current methods are inefficient and consume considerable amounts of energy while performing the two stage process. Substantial amounts of energy are wasted when emptying the heat removed from the computer system into the room and then having to again remove the heat from the room to the outside. This method wastes considerable amounts of energy.

III. SUMMARY OF THE INVENTION

The present invention, in at least one embodiment, removes the thermal energy or heat from computer and electronic systems, and then empties the heat outside the room into another room/space in the building and/or to a location outside of the building.

The present invention, in at least one embodiment, includes an apparatus for efficiently removing heat from heat-generating electronic equipment having at least one electrical component, the apparatus has a first closed-loop system having a first heat exchanger having an inlet and an outlet, and at least one cooling cap in fluid communication with the first heat exchanger such that fluid flows from the outlet of the first heat exchanger to the at least one cooling cap and fluid flows from the at least one cooling cap to the inlet of the first heat exchanger; and a second closed-loop system having a fluid reservoir in thermal communication with the first heat exchanger, the fluid reservoir having an inlet and an outlet, and a second heat exchanger in fluid communication with the fluid reservoir, the second heat exchanger having an inlet and an outlet, the inlet of the second heat exchanger is in fluid communication with the outlet of the fluid reservoir and the outlet of the second heat exchanger is in fluid communication with the inlet of the fluid reservoir; and wherein the second heat exchanger is at a remote location from the fluid reservoir.

The present invention, in at least one embodiment, provides an apparatus for efficiently removing heat from heat-generating electronic equipment, including an inert fluid reservoir containing inert fluid; a first pump disposed in the inert fluid reservoir; one or more cooling caps in fluid communication with the first pump, the cooling caps containing a thermally conductive metal and capable of thermally connecting to one or more electronic devices; a sealed heat exchange unit in fluid communication with the cooling caps and the first pump, the sealed heat exchange unit including a sealed fluid reservoir containing a fluid; and a first heat exchanger disposed within the sealed fluid reservoir; a second heat exchanger in fluid communication with the sealed heat exchange unit, wherein the second heat exchanger is located on the exterior of a room containing the first heat exchanger; one or more fans in thermal communication with the second heat exchanger; and a second pump in fluid communication with the second heat exchanger and the sealed heat exchange unit.

The present invention, in at least one embodiment, provides an apparatus for efficiently removing heat from heat-generating electronic equipment, including a first pump; one or more cooling caps in fluid communication with the first pump, the cooling caps containing a thermally conductive metal and capable of thermally connecting to one or more electronic devices; a sealed heat exchange unit in fluid communication with the cooling caps and the first pump, the sealed heat exchange unit including a sealed fluid reservoir containing a fluid; and a first heat exchanger disposed within the sealed fluid reservoir; a second heat exchanger in fluid communication with the sealed heat exchange unit, wherein the second heat exchanger is located on the exterior of a room containing the first heat exchanger; and a second pump in fluid communication with the second heat exchanger and the sealed heat exchange unit.

A method for efficiently removing heat from heat-generating electronic equipment, including providing an inert fluid reservoir containing inert fluid; disposing a first pump in the inert fluid reservoir; disposing one or more cooling caps in fluid communication with the first pump, wherein the cooling caps contain a thermally conductive metal and are capable of thermally connecting to one or more electronic devices; disposing a sealed heat exchange unit in fluid communication with the cooling caps and the first pump, wherein the sealed heat exchange unit including a sealed fluid reservoir containing a fluid; and a first heat exchanger disposed within the sealed fluid reservoir; disposing a second heat exchanger in fluid communication with the sealed heat exchange unit, wherein the second heat exchanger is located on the exterior of a room containing said first heat exchanger; disposing one or more fans in thermal communication with the second heat exchanger; and disposing a second pump in fluid communication with the second heat exchanger and the sealed heat exchange unit.

A method for efficiently removing heat from heat-generating electronic equipment, including providing a first pump; disposing one or more cooling caps in fluid communication with the first pump, wherein the cooling caps contain a thermally conductive metal and are capable of thermally connecting to one or more electronic device; disposing a sealed heat exchange unit in fluid communication with the cooling caps and the first pump, wherein the sealed heat exchange unit including a sealed fluid reservoir containing a fluid; and a first heat exchanger disposed within the sealed fluid reservoir; disposing a second heat exchanger in fluid communication with the sealed heat exchange unit, wherein the second heat exchanger is located on the exterior of a room containing the first heat exchanger; and disposing a second pump in fluid communication with the second heat exchanger and the sealed heat exchange unit.

IV. BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is described with reference to the accompanying drawings. In the drawings, like reference numbers indicate identical or functionally similar elements. The use of cross-hatching and shading within the drawings is not intended as limiting the type of materials that may be used to manufacture the invention. The use of solid line arrows in the figures is to show fluid flow through the device and dash line arrows in the figures are to show the direction of the transference of heat.

FIG. 1 illustrates an air conditioner eliminator heat exchange system of an example embodiment of the invention.

FIG. 2 illustrates a block diagram of an example embodiment according to the invention.

FIG. 3 illustrates a block diagram of an example embodiment according to the invention.

FIG. 4 illustrates a block diagram of another example embodiment according to the invention.

Given the following enabling description of the drawings, the system and method should become evident to a person of ordinary skill in the art.

V. DETAILED DESCRIPTION OF THE DRAWINGS

The present invention in at least one embodiment includes a computer and electronic systems air conditioner eliminator heat exchange system and method for efficiently eliminating heat from heat-generating, thermally-sensitive equipment such as computer equipment or systems, electronic devices and other electronic equipment that includes electrical components 190. Examples of computer equipment include but not limited to laptops, desktops, servers, gateways, communications devices, image sensors, optics including laser and light sources, and storage arrays or systems. Examples of electrical components include but not limited to processors, chips, hard drives, memory, mother boards, application specific integrated circuits, and integrated circuits. The system and method in at least one embodiment utilizes, at least in part, cooling caps, inert fluid, a series of closed-loop tubes, heat exchanger units and pumps to remove heat from the heat-generating equipment and transport that heat to a remote location such as the exterior of the structure or room housing the heat-generating equipment. Remote location as used in this disclosure means a location that is physically separated by a structural divide from the source. The system and method perform this heat-exchange process without significantly losing any thermal energy to the atmosphere of the structure or room housing the heat-generating equipment.

The system and method outlined with respect to FIG. 1 define a closed-loop, multi-layer heat exchanger system that includes two closed-loop systems that interface for the movement of heat away from electrical components. The system and method efficiently removes heat from the high-heat generating components and moves the heat (heat rejection) to the outside of the building 192 (or at least outside the area where the electronic equipment is located) in a single stage, thereby saving considerable energy. The heat is never released inside the room 192 where the electrical components being cooled are and therefore this reduces (and in some cases eliminates) the need for special computer room cooling to move the heat from the air inside the room to the outside of the building 192.

In various illustrated embodiments, the example systems include two closed-loop systems that interface in a heat exchange unit 180. The first loop system includes a first heat exchanger, at least one pump, and a plurality of cooling caps that are connected together with conduit or other piping. The second loop system includes a liquid (or fluid) reservoir, a second heat exchanger, and at least one pump. The first loop system removes heat from electrical components to which the cooling caps are connected to the first heat exchanger, which is located within the liquid reservoir of the second loop system. The second loop system removes heat from the first loop system through heat transfer between the first heat exchanger and the liquid reservoir and then through conduit that moves the heated fluid to the second heat exchanger, which is at a remote location from the first loop system, where the fluid in the second loop system is cooled and the heat released to the remote location, for example, the outdoors. This structure provides for an efficient release of heat from electrical components without having to cool the entire room where the electrical components are located.

FIG. 1 illustrates one example embodiment according to the invention used for electrical components installed inside a building 192 with the second closed-loop system 150 running from the interior of the building 192 to an area outside the room the electrical components being cooled are including but not limited to an adjacent (or a nearby) room or the outside of the building 192. In the case of another room, the second heat exchanger can be used to heat that room. In an alternative embodiment, the second heat exchanger is omitted and the conduit is used to radiate heat to another room in the structure. In FIG. 1, the solid black lines for the conduit represent cool fluid while the lines for the return conduit including a dash followed by two dots represents the presence of hot fluid in the conduit.

The heat exchange system includes a first closed-loop system 110 and a second closed-loop system 150, which each include fluid running through their respective loops. In the closed-loop systems, different components are fluidly connected together via conduit 120 (120 is used to refer collectively to 120A-G) unless particular components are directly connected or one component (e.g., pump) is submersed in another component (e.g., fluid reservoir). Examples of conduit 120 include but not limited to piping, hoses, and fluid lines. In some embodiments, the conduit 120 is flexible or multi-layered material that assists in leak prevention and/or provides some rigidity to maintain placement of the conduit in the system (e.g., bends and turns). In at least one embodiment, the conduit 120 used in the first closed-loop system 110 includes at least an inner layer made from and/or coated with one of the following: polyethylene, ABS, polyvinylchloride (PVC), acrylic such as Plexiglas™, PTFE such as Teflon™, Ryton™, polyetheretherketone (PEEK), thermoplastics, polypropylene, nylon, polycarbonate such as Lexan™, Rulon™, polysulfone, or phenolic. Although the conduit 120 could be coated or made from other material that would be resistant to the fluid passing through it. Examples of how the conduit 120 may connect to different components include but are not limited to fittings, molded into the component, valves, and/or couplings.

The first closed-loop system 110 includes a first heat exchanger 112 that facilitates transference of heat from the first closed-loop system 110 to the second closed-loop system 150. The first heat exchanger 112 is in fluid communication through conduit 120A-C such as piping to multiple cooling caps 114, which are each attached to an electrical component 190. Fluid communication is used to describe the existence of a fluid pathway between components. In at least one embodiment, there is one cooling cap 114 per electrical component 190 (illustrated in FIGS. 2 and 3) to be cooled; however, in an alternative embodiment (illustrated in FIG. 1) there is at least one electrical component 190 that is connected to at least two cooling caps 114 to dissipate additional heat. As illustrated, when multiple cooling caps 114 are present, the conduit 120B branches into conduits 120C to supply each of the cooling caps 114 separately although they could be connected in series with each other (or some combination of parallel and series connections being used). As the fluid, which is cooler than the operating temperatures of the electrical components 190, passes through the cooling caps 114, the fluid removes heat from the electrical components 190. The fluid is then routed back to the first heat exchanger 112 through conduit 120D.

The first heat exchanger 112 may take a variety of forms such that the fluid passing through it is dispersed through a plurality of channels or flow paths to increase the surface area of the fluid being exposed to the fluid passing through the second closed-loop system 150. The channels in at least one embodiment take the form of micro-channels or capillaries, other example structures include helical configurations and fins. One of ordinary skill in the art will appreciate that there are a variety of structures that are possible with heat exchangers.

Each cooling cap 114 will have a structure with a surface area sufficient for transference of heat from the electrical component 190 to the fluid. In at least one embodiment micro-channels are used to route the fluid through the cooling caps 114.

As illustrated in FIG. 1, the first closed-loop system 110 further includes a fluid reservoir 116 and a first pump 118. The fluid reservoir 116 in at least one embodiment provides a smoothing effect on the flow of fluid through the first closed-loop system 110 and collection point for the cooled fluid exiting the first heat exchanger 112 through conduit 120A. The fluid reservoir 116 is in fluid communication with the first heat exchanger 112, for example, directly (not illustrated) or through conduit 120A. The pump 118 is illustrated as being a submersible pump in the fluid reservoir 116 that feeds the conduits 120B and 120C leading to the cooling caps 114. The pump 118 in at least one embodiment includes an impeller installed inline in the conduit 120A/B connecting the fluid reservoir 116 to the cooling caps 114. In at least one embodiment, the pump 118 is relocated to the inlet side of the heat exchanger 112 (see, e.g., pump 218 and conduit 220D1 and 220D2 in FIG. 3).

The illustrated second closed-loop system 150 includes a liquid (or thermal/second fluid) reservoir 152 and a second heat exchanger 154. The second liquid reservoir 152 houses the first heat exchanger 112, and together the two components in at least one embodiment form a sealed heat exchange unit 180. The second liquid reservoir 152 may take a variety of forms that allow for fluid to enter at an inlet and exit out an outlet while running around, through or by the first heat exchanger 112. The second liquid reservoir 152 and the second heat exchanger 154 are in fluid communication to establish a loop through which fluid circulates.

The second liquid reservoir 152 provides a chamber through which fluid passes through, around, and/or by the first heat exchanger 112 to provide for heat transference from the fluid in the first closed-loop system 110 to the fluid in the second closed-loop system 150. This arrangement places the second liquid reservoir 152 in thermal communication with the first heat exchanger 112. In the illustrated embodiment, the fluids flow in opposite directions through the heat exchange unit 180. The illustrated flow provides a benefit of increasing the transference of heat between the two closed-loops.

The second heat exchanger 154 may take a variety of forms that allow for the fluid passing through the second closed-loop system 150 to be cooled before exiting the second heat exchanger 154. As illustrated in FIG. 1, the second heat exchanger 154 may have a configuration similar to that of a radiator or capillary structure with at least one fan 156 facilitating air movement through the second heat exchanger 154 to cool the fluid passing through it. The fan 156 is in thermal communication with the passageways through which the fluid passes through the second heat exchanger 154. As mentioned previously, the second heat exchanger 154 is at a remote location from the second liquid reservoir 152.

Also illustrated in FIG. 1 is a pump 158 located along the return path (conduit 120F/G) from the second heat exchanger 154 to the second fluid reservoir 152. The pump 158 in at least one embodiment is similar to the first pump 118 including being a submersible pump inside the second fluid reservoir 152. Other examples for the pump 158 include a mechanical pump or an impeller. The pump 158 may alternatively be located at the inlet side of the second heat exchanger 154.

The conduit 120 provides the fluid pathway between the second liquid reservoir 152 and the second heat exchanger 154 (120E), between the second heat exchanger 154 and the pump 158 (when present)(120F), and between the pump 158 and the second liquid reservoir 152 (120G). When the pump 158 is on the hot water side of the second closed-loop, then the conduit 120E will connect to the pump 158 between the second liquid reservoir 152 and the second heat exchanger 154 (see, e.g., conduit 120E1 and 120E2 in FIG. 3) and connect the second heat exchanger 154 to the second liquid reservoir 152.

In use, the pump 118 moves the fluid through conduit 120A-C and into cooling caps 114 containing a thermally conductive material, such as thermally conductive metals. The fluid removes heat from the surface of the electrical component 190 via cooling caps 114 thereby cooling the electrical component 190. The heat removed from the electrical component 190 is absorbed by the fluid which passes through conduit 120D and into the heat exchanger 112 of the sealed heat exchange unit 180. The liquid contained in the second liquid reservoir 152 removes heat from the fluid entering the heat exchanger unit 112 via conduit 120D as the fluid passes through it.

The first heat exchanger 112 is housed within the second liquid reservoir 152. The second liquid reservoir 152 contains a secondary liquid such as water that envelopes the first heat exchanger 112. Conduit 120E connects the second liquid reservoir 152 to the second heat exchanger 154. The second heat exchanger 154 is located on the exterior of the room or structure 192 (i.e., a remote location) containing the electrical component(s) 190. In use, the pump 158 moves the fluid through the second closed-loop system 150 to remove the heat contained in the fluid circulating through the first closed-loop system 110. Although the second pump 158 is illustrated as being connected to the outlet side of the second heat exchanger 154 within the structure housing the electrical component(s) 190, the second pump 158 could also be located outside the room (or enclosure) with the electrical component(s) 190. The second pump 158 connects the second heat exchanger 154 with the second liquid reservoir 152, and as such may be located on either side of the closed loop system. In a further embodiment, there is at least one pump along each conduit line to facilitate the flow of fluid through the second closed-loop system over a distance.

FIG. 1 also illustrates an embodiment where the conduit 120A is separated into multiple conduits 120C for connection to the multiple cooling caps 114 through a manifold 119. FIG. 1 also illustrates a couple of approaches for providing a common return conduit 120D as illustrated by connectors 122.

In at least one embodiment, the fluid circulating through the first closed-loop system 110 is an inert liquid that is non-conductive, non-toxic, non-corrosive. Alternative fluids include but are not limited to oil such as vegetable oil, mineral oil, petroleum or other oils; water; propylene glycol; ethanol; and isopropanol (IPA). In at least one embodiment, the fluid circulating through the second closed-loop system 150 is water or an oil such as vegetable oil, mineral oil or petroleum oil, although the different possibilities for the fluid in the first closed-loop system 110 could also be used in the second closed-loop system 150. In another embodiment, the fluid used in at least one of the closed-loops is in a liquid state when cooled but may become a gas as part of the heat extraction process before reverting to liquid form while passing through the respective heat exchanger.

In a further embodiment, the liquid used in the first closed-loop system 110 is an inert liquid, for example, a perfluorocarbon like Fluorinet™ sold by 3M to eliminate any damage that would be caused by a leak in a conductive liquid like water or a glycol alcohol mixture. The purpose of the fluid in the second closed-loop system 150 is to facilitate efficient heat exchange, allow pumping over longer distances, to reduce the fluid weight, and to reduce coolant cost and as such water may be used.

In at least one embodiment, the two closed-loops do not exchange any fluids and operate independently from each other with separate fluids, pumps, sensors, heat exchangers and liquid speed controls. The only interaction between these two systems 110, 150 is the heat exchange that occurs completely within the sealed heat exchange unit 180.

Another example embodiment of the operation and setup as illustrated in FIG. 1 including examples of the material that is used in this example embodiment is as follows. As the electrical component(s) 190 generate heat, the heat is removed from their surfaces via the cooling cap(s) 114 placed in contact with those devices with a thermal grease compound commonly in use today. The heat exchange occurs between the electrical component(s) 190 and the metal within the cooling cap(s) 114.

The heat exchange next occurs between the metal in the cooling cap(s) 114 and the cool inert liquid transported via conduit 120A and moved by the first pump 118. The now-hot inert liquid is transported by the conduit 120D to the hot side of the first heat exchanger 112 contained within the sealed heat exchange unit 180. The heat exchange occurs between the hot inert liquid and the metal of the first heat exchanger 118 as the inert liquid is pumped through the capillaries within the first heat exchanger 118.

The heat exchange then occurs between the metal capillaries of the first heat exchanger 118 to the cool liquid present inside the sealed heat exchange unit 180. The now-cooled inert liquid returns to the electrical components 190 via the first pump 118 that may be external to or contained within the inert fluid reservoir 116. The heated liquid in the sealed heat exchange unit 180 is pumped out of the sealed heat exchange unit 180 through conduit 120E such as plumbing tubes to the outside of the building to the second heat exchanger 154 where the liquid transfers heat to the metal capillaries of the second heat exchanger 154. The heat exchange occurs between the capillaries of the second heat exchanger 154 and the outside air by forced air fans 156 and/or a combination of spray evaporative cooling and forced air fans 156. The cooled liquid in the second closed-loop system 150 is pumped with the assistance of the second pump 158 back into the building through conduit 120F/G such as plumbing tubes and returned to the sealed heat exchange unit 180.

The system as described in this example embodiment includes two separate sealed heat exchange systems (or closed-loops). The first closed-loop system 110 is a sealed system that moves the heat from the electrical component(s) 190 to the first heat exchanger 112. The second closed-loop system 150 is a sealed system that moves heat from the first heat exchanger 112 to the outside second heat exchanger 154.

FIGS. 2 and 3 illustrate two additional embodiments according to the invention. Both of these illustrated embodiments include two closed-loop systems that work together. The arrow lines represent the direction of the flow of fluid through the two closed-loop systems. The wall 292 is imposed to illustrate that the second closed-loop system is present in two different locations (i.e., the area where at least one electrical component 290 is located and a remote location). The break lines present on conduit 220E, 220F illustrate that the length of the conduit could be a variety of lengths as the figures in this document are not drawn to scale.

The first closed-loop system 210 includes a first heat exchanger 212, at least one cooling cap (although FIG. 2 illustrates two or more cooling caps 214 attached to electrical components 290), and a first pump 218. These components are fluidly connected together with conduit 220 (220 is used to refer collectively to 220A-G). FIGS. 2 and 3 illustrate two different placements of the first pump 218, although an alternative embodiment would be to have two first pumps 218 present with one on either side of the first heat exchanger 212.

The second closed-loop system 250 includes a fluid reservoir 252 enclosing the first heat exchanger 212, a second heat exchanger 254, and a second pump 258. These components are fluidly connected together with conduit 220E-F/G. FIGS. 2 and 3 illustrate two different placements for the second pump 258, although an alternative embodiment would include a pump 258 at the inlet side of the second heat exchanger 254 and the outlet side of the second heat exchanger 254. In an alternative embodiment, the second heat exchanger 254 and the second pump 258 are integrally formed together as a compressor unit to both move fluid through the second closed-loop system 250 and also cool the fluid as it passes through the compressor unit using at least one fan.

The first heat exchanger 212 and the fluid reservoir 252 together are a sealed heat exchange unit 280 that provides for the fluid flow in the first closed-loop system 210 to be in the opposite direction of the fluid flow in the second closed-loop system 250. This allows for the fluid in the first closed-loop system 210 to cool down as the heat is transferred to the fluid in the second closed-loop system 250, which is flowing in the opposite direction. In an alternative embodiment the fluid flows through the heat exchange unit 280 are in the same direction.

Although illustrated in FIGS. 2 and 3, if only one electrical component 190 was present to be cooled, then instead of multiple cooling caps 114 being present there would be one present unless additional cooling was required for the one electrical component 190.

FIG. 4 illustrates another example embodiment according to the invention. The illustrated apparatus in FIG. 4 is designed to use inert fluid in its closed loop. Unlike the embodiments illustrated in FIGS. 1-3, there is one closed-loop present in the illustrated apparatus. The heat exchanger 412 is placed at a remote location such as another room in the building 292 or on the outside of the building 292. The heat exchanger 412 in at least one embodiment is similar to the second heat exchangers 154, 254 discussed previously. The heat exchanger 412 as illustrated is connected with conduit 120A to the fluid reservoir 416. In the illustrated embodiment, the pump 418 is illustrated as being located on the inside of the fluid reservoir 416, for example, as a submersible pump. Alternatively, the pump 418 could be located on the outside of the fluid reservoir 416, for example, connected to either the inlet or outlet of the fluid reservoir 416. The pump 418 is connected with conduit 120B, which is illustrated as being branched into conduits 120C, for example, as through a manifold. As discussed previously, the conduit structure leading to the one or more cooling caps 214 (or 114) can take a variety of forms. The conduit 120C provides the fluid pathway into the cooling cap 214. The cooling cap 214 then in turn releases the inert fluid into conduit 120D that then connects to the inlet of the heat exchanger 412. This structure forms a pathway through which the inert fluid flows and is driven by the pump 418. As discussed in connection with the other embodiments, additional pumps may be added to the closed-loop.

The above-described embodiments of the multi-layer (or single layer) heat exchanger system may be used to cool a plurality of electrical equipment located in a structure, for example, including but not limited to in a room of a data center, onboard an aircraft including drones and UVAs, in a space or room in temporary building structures such as military tents, in mobile platforms, and mounted on airframes. In such a configuration and depending upon the amount of electrical equipment to be cooled, there may be one or more of the heat exchanger systems used to cool the equipment. When there are multiple heat exchange systems being used to cool the electronic equipment, then the conduit from to and from at least two liquid reservoir of the second closed-loop system are combined in at least one embodiment for interaction and sharing of one second heat exchanger between the at least two liquid reservoirs.

The invention also includes the set-up of a multi-layer heat exchanger system that includes the placement of the different components and establishing the various connections between the components. The method also includes injecting or adding the relevant fluid into each closed-loop system.

In another embodiment, the invention includes a method for the operation of a heat exchanger system as described in connection with the embodiments discussed above. An example embodiment of such a method is as follows: pumping a first fluid through at least one cooling cap attached to at least one heat producing component; moving the first fluid from the cooling cap to a first heat exchange unit; transferring heat from the first fluid to a second fluid in the first heat exchange unit; recycling the first fluid back to the cooling cap; moving the second fluid to an external heat exchanger located outside of an environment where the first heat exchange unit is located; transferring heat from the second fluid to the environment in the external heat exchanger; and moving the second fluid back to the first heat exchange unit.

It should be noted that the present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, the embodiments set forth herein are provided so that the disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. The accompanying drawings illustrate exemplary embodiments of the invention.

Although the present invention has been described in terms of particular example and alternative embodiments, it is not limited to those embodiments. Alternative embodiments, examples, and modifications which would still be encompassed by the invention may be made by those skilled in the art, particularly in light of the foregoing teachings. The embodiments described above may be combined in a variety of ways with each other.

As used above “substantially,” “generally,” and other words of degree are relative modifiers intended to indicate permissible variation from the characteristic so modified. It is not intended to be limited to the absolute value or characteristic which it modifies but rather possessing more of the physical or functional characteristic than its opposite, and preferably, approaching or approximating such a physical or functional characteristic.

Those skilled in the art will appreciate that various adaptations and modifications of the example and alternative embodiments described above can be configured without departing from the scope and spirit of the invention. Therefore, it is to be understood that, within the scope of the appended claims, the invention may be practiced other than as specifically described herein. 

1. An apparatus for efficiently removing heat from heat-generating electronic equipment having at least one electrical component, said apparatus comprising: a first closed-loop system having a first heat exchanger having an inlet and an outlet, and at least one cooling cap in fluid communication with said first heat exchanger such that fluid flows from the outlet of said first heat exchanger to said at least one cooling cap and fluid flows from said at least one cooling cap to the inlet of said first heat exchanger; and a second closed-loop system having a thermal fluid reservoir in thermal communication with said first heat exchanger, said thermal fluid reservoir having an inlet and an outlet, and a second heat exchanger in fluid communication with said thermal fluid reservoir, said second heat exchanger having an inlet and an outlet, the inlet of said second heat exchanger is in fluid communication with the outlet of said thermal fluid reservoir and the outlet of said second heat exchanger is in fluid communication with the inlet of said thermal fluid reservoir; and wherein said second heat exchanger is at a remote location from said thermal fluid reservoir.
 2. The apparatus according to claim 1, wherein said first closed-loop system further includes a fluid reservoir in fluid communication with the outlet of said first heat exchanger, said fluid reservoir having an opening through at least one wall, a first pump in fluid communication with said fluid reservoir and said at least one cooling cap.
 3. The apparatus according to claim 2, wherein said first closed-loop system further includes at least one conduit connecting said first pump to said at least one cooling cap, said first pump includes a submersible pump located in said fluid reservoir, said first pump having an outlet in fluid communication with one of said at least one conduit where said one of said at least one conduit passes through the opening of said fluid reservoir.
 4. The apparatus according to claim 1, wherein said first closed-loop system further includes a first pump in fluid communication with said first heat exchanger and said at least one cooling cap, said first pump located between the outlet of said first heat exchanger and said at least one cooling cap.
 5. The apparatus according to claim 1, wherein said first closed-loop system further includes a first pump in fluid communication with said first heat exchanger and said at least one cooling cap, said first pump located between the inlet of said first heat exchanger and said at least one cooling cap.
 6. The apparatus according to claim 4, wherein said first closed-loop system further includes a fluid reservoir in which said first pump is located.
 7. The apparatus according to claim 2, wherein said second heat exchanger includes a second pump.
 8. The apparatus according to claim 1, wherein said second closed-loop system further includes a pump in fluid communication with said second heat exchanger and said thermal fluid reservoir, said pump located between the outlet of said second heat exchanger and the inlet of said thermal fluid reservoir.
 9. The apparatus according to claim 1, wherein said second closed-loop system further includes a pump in fluid communication with said second heat exchanger and said thermal fluid reservoir, said pump located between the inlet of said second heat exchanger and the outlet of said thermal fluid reservoir.
 10. The apparatus according to claim 1, wherein said second heat exchanger includes a second pump.
 11. The apparatus according to claim 1, wherein said second heat exchanger further includes a plurality of channels through which fluid passes between the inlet and the outlet of said second heat exchanger, and at least one fan positioned to move air pass said plurality of channels.
 12. The apparatus according to claim 1, wherein fluid communication is provided through a plurality of conduit.
 13. The apparatus according to claim 1, further comprising an inert fluid in said first closed-loop system, and a second fluid in said second closed-loop system.
 14. The apparatus according to claim 13, wherein said second fluid includes water.
 15. A system comprising: a structure having a room or space, a plurality of electronic equipment having at least one electrical component to have heat transferred from, where said plurality of electronic equipment is located in said room or space of said structure, at least one heat exchanger system having at least one of said apparatus according to claim 1 connected to at least one of said plurality of electronic equipment, wherein for each electrical component of the connected plurality of electronic equipment at least one of said at least one cooling cap is attached to said electrical component, said first closed-loop system is located in said room and said second heat exchanger is at a remote location from said room.
 16. The system according to claim 15, wherein at least two apparatus share a common second heat exchanger.
 17. (canceled)
 18. An apparatus for efficiently removing heat from heat-generating electronic equipment, comprising: a first pump; at least one cooling cap in fluid communication with said first pump, said cooling caps containing a thermally conductive metal and capable of thermally connecting to one or more electronic devices; a sealed heat exchange unit in fluid communication with said cooling caps and said first pump, said sealed heat exchange unit comprising: a sealed fluid reservoir containing a fluid; and a first heat exchanger disposed within said sealed fluid reservoir; a second heat exchanger in fluid communication with said sealed heat exchange unit, wherein said second heat exchanger is located on the exterior of a room containing said first heat exchanger; and a second pump in fluid communication with said second heat exchanger and said sealed heat exchange unit.
 19. The apparatus according to claim 18, further comprising: an inert fluid reservoir containing inert fluid, wherein said first pump is disposed in said inert fluid reservoir.
 20. The apparatus according to claim 18, further comprising: one or more fans in thermal communication with said second heat exchanger.
 21. The apparatus according to claim 18, further comprising: at least one first conduit connecting said first pump to said at least one cooling cap; at least one second conduit connecting said at least one cooling cap to said first heat exchanger; at least one third conduit connecting said first heat exchanger to said first pump; at least one fourth conduit connecting said sealed fluid reservoir to said second heat exchanger; at least one fifth conduit connecting said second heat exchanger to said second pump; at least one sixth conduit connecting said second pump to said sealed fluid reservoir; said at least one first conduit, said at least one second conduit, said at least one third conduit, said first pump, said at least one cooling cap, and said first heat exchanger form a closed fluid loop; and said at least one fourth conduit, said at least one fifth conduit, said at least one sixth conduit, said second pump, said sealed fluid reservoir, and said second heat exchanger for a second closed fluid loop.
 22. (canceled)
 23. A method comprising: pumping a first fluid through at least one cooling cap attached to at least one heat producing component; moving the first fluid from the cooling cap to a first heat exchange unit; transferring heat from the first fluid to a second fluid in the first heat exchange unit; recycling the first fluid back to the cooling cap; moving the second fluid to an external heat exchanger located outside of an environment where the first heat exchange unit is located; transferring heat from the second fluid to the environment in the external heat exchanger; and moving the second fluid back to the first heat exchange unit.
 24. (canceled)
 25. (canceled)
 26. (canceled)
 27. (canceled)
 28. (canceled) 